KHAA84901B-JC17T00
HBM2E stacked with 8 layers, delivering powerful performance in the memory industry. outstanding power efficiency, and superior thermal resistance. It extends to a wide range of applications, cementing its position as a key enabler for AI technology. EOL
● 容量:16GB
● 速率:3.6Gbps
● 架构:1024, 8Hi
● 封装&包装:MPGA, 1300pcs/Reel
● 刷新:32ms